#SemiconductorEquipment

Yonhap Infomax Newsinfomaxkorea
2025-11-26

Applied Materials unveiled a hybrid bonding system that streamlines next-generation HBM chip stacking, reducing process time from 13 hours to 1 hour and boosting efficiency for advanced semiconductor manufacturing.

en.infomaxai.com/news/articleV

Santhoshsanthoshtbrc
2025-11-05

Wafer Fab Equipment Market Size, Share|Industry Report 2034

The Wafer Fab Equipment market size is expected to reach $121.40 billion in 2029 at a CAGR of 9.6%, driven by the surge in demand for advanced semiconductors

Read More @
thebusinessresearchcompany.com

The Wafer Fab Equipment market size is expected to reach $121.40 billion in 2029 at a CAGR of 9.6%, driven by the surge in demand for advanced semiconductors
Yonhap Infomax Newsinfomaxkorea
2025-10-24

Applied Materials Inc. will cut about 1,400 jobs, or 4% of its global workforce, citing automation and shifting regional demands, with restructuring costs expected to reach up to $180 million.

en.infomaxai.com/news/articleV

Yonhap Infomax Newsinfomaxkorea
2025-10-15

ASML forecasts a sharp decline in China sales for 2025 but assures investors that total revenue will remain at or above 2024 levels, despite missing Q3 revenue estimates.

en.infomaxai.com/news/articleV

Yonhap Infomax Newsinfomaxkorea
2025-09-10

Hanwha Semitek, a subsidiary of Hanwha Vision, will launch a next-generation hybrid bonder early next year, aiming to boost its presence in the semiconductor equipment market as major players like Samsung Electronics and SK hynix consider adopting the technology for future HBM production.

en.infomaxai.com/news/articleV

Yonhap Infomax Newsinfomaxkorea
2025-09-02

The US will revoke TSMC’s exemption for importing American chip equipment to its China plant, extending export controls already imposed on Samsung and SK hynix, as Washington tightens restrictions on advanced semiconductor technology transfers to China.

en.infomaxai.com/news/articleV

Yonhap Infomax Newsinfomaxkorea
2025-09-02

US tightens semiconductor equipment export controls on TSMC's China plant, extending restrictions previously applied to Samsung and SK, signaling heightened tech tensions.



en.infomaxai.com/news/articleV

Yonhap Infomax Newsinfomaxkorea
2025-08-29

The US will revoke broad export licenses for Samsung Electronics, SK Hynix, and Intel, requiring case-by-case approval for US chip equipment shipments to China, tightening controls on advanced semiconductor technology transfers.



en.infomaxai.com/news/articleV

Yonhap Infomax Newsinfomaxkorea
2025-08-29

The US government will revoke licenses for Samsung Electronics, SK Hynix, and Intel to buy US chip equipment for use in China, requiring new approvals and tightening export controls on semiconductor technology.

en.infomaxai.com/news/articleV

Yonhap Infomax Newsinfomaxkorea
2025-06-23

SK Hynix faces mounting risks as US-China tech tensions threaten its China-dependent production, with potential US export curbs posing a major challenge despite record-high share prices.

en.infomaxai.com/news/articleV

Yonhap Infomax Newsinfomaxkorea
2025-05-01

Hanwha Semitec establishes Advanced Packaging Equipment Development Center, focusing on next-gen semiconductor technologies like hybrid bonding to meet growing TC bonder demand and lead global market

en.infomaxai.com/news/articleV

Yonhap Infomax Newsinfomaxkorea
2025-04-17

Hanwha Semitech gains prominence in TC bonder market, secures orders from SK hynix, and eyes potential for additional contracts amid growing HBM demand and market dynamics.

en.infomaxai.com/news/articleV

Yonhap Infomax Newsinfomaxkorea
2025-02-18
Yonhap Infomax Newsinfomaxkorea
2025-02-10

Hanwha Group's third son Kim Dong-seon joins Hanwha Semitech as Head of Future Vision, aiming to revolutionize semiconductor market with focus on HBM equipment and R&D investment

en.infomaxai.com/news/articleV

Client Info

Server: https://mastodon.social
Version: 2025.07
Repository: https://github.com/cyevgeniy/lmst