Micron Begins Shipping HBM4 Memory To Key Customers #hardware #hbm4 #memory #micron
HBM4 wird bemustert: Micron folgt SK Hynix und kommt Samsung zuvor https://www.computerbase.de/news/arbeitsspeicher/hbm4-wird-bemustert-micron-folgt-sk-hynix-und-kommt-samsung-zuvor.93087/ #Micron #HBM4
Teurer Speicher: HBM4 soll 30 Prozent mehr als HBM3E kosten https://www.computerbase.de/news/arbeitsspeicher/teurer-speicher-hbm4-soll-30-prozent-mehr-als-hbm3e-kosten.92875/ #HBM4
Samsung Electronics reveals ongoing talks with multiple customers for HBM4 technology, targeting mass production launch in the latter half of the year
#YonhapInfomax #SamsungElectronics #HBM4 #MassProduction #CustomerNegotiations #TechnologyDevelopment #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=61129
SK hynix showcases HBM4 with TSMC logic process at TSMC symposium, aiming to strengthen AI memory leadership through technological collaboration
#YonhapInfomax #SKHynix #HBM4 #TSMC #AIMemory #TechnologySymposium #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=60360
Standard veröffentlicht: HBM4 ist fertig und noch etwas schneller geworden https://www.computerbase.de/news/arbeitsspeicher/standard-veroeffentlicht-hbm4-ist-fertig-und-noch-etwas-schneller-geworden.92293/ #HBM4 #JEDEC
SK hynix solidifies HBM market leadership by supplying world's first HBM4 12-layer samples to major customers, including NVIDIA, showcasing unprecedented data processing speeds and capacity for AI applications.
#YonhapInfomax #SKHynix #HBM4 #ArtificialIntelligence #Semiconductor #NVIDIA #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=54743
SK hynix showcases partnership with NVIDIA at GTC 2025, unveiling HBM4 and SOCAMM, highlighting its position as a key supplier in the AI semiconductor market
#YonhapInfomax #SKHynix #NVIDIA #HBM4 #SOCAMM #AIMemory #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=54621
Samsung verwerft goedkeuring van nvidia voor levering van minder geavanceerd ai-geheugen https://www.trendingtech.news/trending-news/2025/01/52141/samsung-verwerft-goedkeuring-van-nvidia-voor-levering-van-minder-geavanceerd-ai-geheugen #Samsung #Nvidia #AI-geheugen #SK Hynix #HBM4 #Trending #News #Nieuws
Anfrage bei SKHynix: Nvidia will früher auf HBM4-Chips mit 1,6 TB/s setzen können https://www.computerbase.de/news/arbeitsspeicher/anfrage-bei-skhynix-nvidia-will-frueher-auf-hbm4-chips-mit-1-6-tb-s-setzen-koennen.90176/ #Nvidia #HBM4 #SKHynix
JEDEC Approaches Finalization of #HBM4 Standard, Eyes Future Innovations
HBM4 is set to introduce a doubled channel count per stack compared to HBM3, with a larger physical footprint
HBM4 will specify 24 Gb and 32 Gb layers, with options for supporting 4-high, 8-high, 12-high and 16-high TSV stacks
The committee has initial agreement on speeds bins up to 6.4 Gbps with discussion ongoing for higher frequencies
Samsung To Launch 3D Stacked HBM Memory By 2025 #3dstackedpackaging #airobotics #hardware #hbm #hbm4 #memory #saintd #samsung
https://www.lowyat.net/2024/324831/samsung-to-launch-3d-stacked-hbm-memory-by-2025/
SKhynix plans to commence mass production of #HBM3E in 1H2024
#HBM4 is set for sampling in 2025 and mass production in 2026
https://xiaomitoday.com/sk-hynix-unveils-ambitious-hbm-roadmaps-at-semicon-korea-2024/
#HBM4 to double speeds in 2026 — 2048-bit interface to revolutionize #AI and #HPC markets
Trendforce reports that HBM4 will significantly depart from traditional standardized DRAM technologies to more customized solutions
HBM4 will mark the first use of a 12nm process wafer for its bottommost logic die, to be supplied by foundries
HBM4 is set to expand from the current 12-layer (12hi) to 16-layer (16hi) stacks, spurring demand for new hybrid bonding techniques
SK hynix & Nvidia reportedly working on a #GPU redesign that 3D-stacks #HBM4 directly on top of the processing cores, eliminating interposers
This resembles AMD's 3D V-Cache, which is placed directly on CPU dies, but HBM will be bigger capacity & cheaper, albeit slower
https://www.tomshardware.com/news/sk-hynix-plans-to-stack-hbm4-directly-on-logic-processors
High Bandwidth Memory (HBM): Samsung bemustert HBM3E in Kürze, bis 2025 kommt HBM4 (Update 1) https://www.computerbase.de/2023-10/high-bandwidth-memory-hbm-samsung-bemustert-hbm3e-in-kuerze-bis-2025-kommt-hbm4/#update-2023-10-19T11:11 #Samsung #HBM4