#hbm4

Lowyat.NETlowyat
2025-06-12
Yonhap Infomax Newsinfomaxkorea
2025-04-30

Samsung Electronics reveals ongoing talks with multiple customers for HBM4 technology, targeting mass production launch in the latter half of the year

en.infomaxai.com/news/articleV

Yonhap Infomax Newsinfomaxkorea
2025-04-25

SK hynix showcases HBM4 with TSMC logic process at TSMC symposium, aiming to strengthen AI memory leadership through technological collaboration

en.infomaxai.com/news/articleV

토픽트리topictree
2025-03-24
🔘 G◍M◍◍T 🔘gomoot@mastodon.uno
2025-03-19
Yonhap Infomax Newsinfomaxkorea
2025-03-19

SK hynix solidifies HBM market leadership by supplying world's first HBM4 12-layer samples to major customers, including NVIDIA, showcasing unprecedented data processing speeds and capacity for AI applications.

en.infomaxai.com/news/articleV

Yonhap Infomax Newsinfomaxkorea
2025-03-18

SK hynix showcases partnership with NVIDIA at GTC 2025, unveiling HBM4 and SOCAMM, highlighting its position as a key supplier in the AI semiconductor market

en.infomaxai.com/news/articleV

HPC GuruHPC_Guru
2024-07-11

JEDEC Approaches Finalization of Standard, Eyes Future Innovations

HBM4 is set to introduce a doubled channel count per stack compared to HBM3, with a larger physical footprint

HBM4 will specify 24 Gb and 32 Gb layers, with options for supporting 4-high, 8-high, 12-high and 16-high TSV stacks

The committee has initial agreement on speeds bins up to 6.4 Gbps with discussion ongoing for higher frequencies

jedec.org/news/pressreleases/j

🔘 G◍M◍◍T 🔘gomoot@mastodon.uno
2024-05-15

💻 Samsung e SK Hynix cessano la produzione di memorie DDR3 per soddisfare la domanda di memorie HBM3

gomoot.com/samsung-e-sk-hynix-

#blog #ddr3 #DRAM #HBM #HBM2E #HBM3 #HBM4 #ia #news #picks #tech #tecnologia

HPC GuruHPC_Guru
2024-02-05

SKhynix plans to commence mass production of in 1H2024

is set for sampling in 2025 and mass production in 2026

xiaomitoday.com/sk-hynix-unvei

HPC GuruHPC_Guru
2023-11-27

to double speeds in 2026 — 2048-bit interface to revolutionize and markets

Trendforce reports that HBM4 will significantly depart from traditional standardized DRAM technologies to more customized solutions

HBM4 will mark the first use of a 12nm process wafer for its bottommost logic die, to be supplied by foundries

HBM4 is set to expand from the current 12-layer (12hi) to 16-layer (16hi) stacks, spurring demand for new hybrid bonding techniques

tomshardware.com/pc-components

HPC GuruHPC_Guru
2023-11-19

SK hynix & Nvidia reportedly working on a redesign that 3D-stacks directly on top of the processing cores, eliminating interposers

This resembles AMD's 3D V-Cache, which is placed directly on CPU dies, but HBM will be bigger capacity & cheaper, albeit slower

tomshardware.com/news/sk-hynix

ComputerBaseComputerBase
2023-10-19

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