#HeatManagement

2026-01-26

Tomโ€™s Hardware: 3D-printed fan-less and pump-less liquid cooler can deliver 600 watts of cooling for data centers โ€” passive design provides reusable heat, exceeds pr. โ€œA research team comprising boffins from the Danish Technological Institute and the Heatflow company have come up with a 3D-printed cooler that can draw a whopping 600 W off a chip fully passively, without any pumps or fans, 3D [โ€ฆ]

https://rbfirehose.com/2026/01/26/toms-hardware-3d-printed-fan-less-and-pump-less-liquid-cooler-can-deliver-600-watts-of-cooling-for-data-centers-passive-design-provides-reusable-heat-exceeds-pr/
2026-01-23

Thermal control is often the silent performance killer in outdoor digital signage. Passive cooling designs can outperform active systems in dusty environments.
#ThermalDesign #PassiveCooling #OutdoorElectronics #HeatManagement

performance killer in outdoor digital signage
Ashish Jadhavashu1411
2025-10-08

๐€ ๐‚๐จ๐ฆ๐ฉ๐ฅ๐ž๐ญ๐ž ๐’๐ญ๐ฎ๐๐ฒ ๐†๐ฎ๐ข๐๐ž ๐ญ๐จ ๐‹๐„๐ƒ ๐๐š๐œ๐ค๐š๐ ๐ข๐ง๐ 

๐Ÿ“š๐†๐ž๐ญ ๐’๐š๐ฆ๐ฉ๐ฅ๐ž ๐‚๐จ๐ฉ๐ฒ
theinsightpartners.com/reports

2025-09-25

. It's a reminder that while Moore's Law pushes limits, physics sets boundaries. The future of tech hinges on breakthroughs in materials and cooling to keep advancing. #TechInnovation #DarkSilicon #SemiconductorTech #ComputingFuture #HeatManagement #MooresLaw (2/2)

2025-06-21

TechXplore: Passive cooling paint sweats off heat to deliver 10X cooling and 30% energy savings. โ€œThis design enabled [the paint] to achieve superior cooling by combining both radiative, evaporative and reflective cooling mechanisms, which allowed it to reflect 88โ€“92% of sunlight, emit 95% of the heat as infrared radiation, and hold about 30% of its weight in water, making it a paint ideal [โ€ฆ]

https://rbfirehose.com/2025/06/21/techxplore-passive-cooling-paint-sweats-off-heat-to-deliver-10x-cooling-and-30-energy-savings/

2025-02-06

Carnegie Mellon: Thermal interface material slashes AI data center cooling cost and GPU/CPU power use. โ€œToday, up to 40% of data center power use comes from cooling high-power chipsโ€”an astounding amount equivalent to the state of Californiaโ€™s entire electricity consumption. To combat this, Sheng Shen, professor of Mechanical Engineering at Carnegie Mellon University has developed an [โ€ฆ]

https://rbfirehose.com/2025/02/06/carnegie-mellon-thermal-interface-material-slashes-ai-data-center-cooling-cost-and-gpu-cpu-power-use/

The Big Mammothtbm
2017-06-19

should I really grill the eggplants at 275ยฐC in the oven if it is >30ยฐC outside?!

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