A UV grooving process is often used as a preliminary step to perform dicing in the #semiconductor industry. An article reviews how diffractive #UV #BeamSplitters, also known as multi-spot diffractive optical elements (#DOEs), enable high throughput wafer grooving in the semiconductor packaging industry. Learn more: https://ilphotonics.com/diffractive-uv-beam-splitters-enable-high-speed-laser-grooving-in-semiconductors/