📡 Stacking GPUs and AI chips with optical circuits for compact design and blazing-fast 114 Tbps bandwidth!
AI semiconductors are evolving with optical-electrical fusion and 3D integration.
• Next-gen Co-Packaged Optics (CPO): “M1000”
• Optical, electrical, and AI chips all packed into a 91mm × 85mm package
• SerDes + PIC + EIC + AI chip — fully stacked
https://xtech.nikkei.com/atcl/nxt/column/18/00001/10660/
#Optoelectronics #Photonics #CoPackagedOptics #AIChips #3DIntegration #PhotonicComputing #semiconductors