2月3日(火)13:00-17:25に、エレクトロニクス実装学会 #JIEP 最先端めっき実装研究会が2025年度第2回公開研究会「先端半導体パッケージとCu-Cu直接接合 -ハイブリッドボンディングおよびその周辺技術の最前線- 」を開催。講演5件。大阪市浪速区・大阪府立大学I-siteなんばおよびオンラインにて。詳細は https://jiep.or.jp/tech-committees/pdf/20260203.pdf に。
#Seminar #AdvancedPackaging #HybridBonding

https://winbuzzer.com/2026/01/20/taiwan-unveils-open-access-chip-packaging-platform-to-challenge-tsmcs-dominance-xcxwbn/

Taiwan Unveils Open-access Chip Packaging Platform to Challenge TSMC’s Dominance

#TSMC #Semiconductors #AIChips #ChipManufacturing #Hardware #NVIDIA #AMD #Intel #Google #AI #ChipIndustry #AIHardware #AdvancedPackaging #Taiwan #CoWoS

SK hynix will invest 19 trillion won ($14.3 billion) to build a new advanced packaging fab in Cheongju, aiming to meet soaring global AI memory demand and strengthen its production base.
#YonhapInfomax #SKHynix #Cheongju #AdvancedPackaging #HBM #AIMemoryDemand #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=99484

SK hynix Inc. will invest 19 trillion won ($14.3 billion) to build an advanced packaging fab in Cheongju, targeting soaring AI memory demand with completion set for late next year.
#YonhapInfomax #SKHynix #AdvancedPackaging #Cheongju #AIMemory #19TrillionWon #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=99480

TSMC will sich mit einer eigenen Talent-Pipeline die Fachkräfte für die neue Chipfabrik in Dresden selbst heranziehen. Hunderte Taiwanesen unterstützen den Hochlauf der 10,5-Milliarden-Euro-Fab.
https://oiger.de/2025/11/11/tsmc-chipfabrik-baut-eigene-talent-pipeline-in-dresden-auf/195684
#ESMC #Bosch #Infineon #NXP #Sachsen #Mikroelektronik #AdvancedPackaging #Foundry2.0 #Endmontage #Backend

11月21日（金）13:00-17:00に、グローバルネット㈱がセミナー『先端パッケージにおけるパネルレベル基板プロセスの動向』を開催。講演4件。東京都千代田区・プラザエフおよびオンライン(Zoom)にて。詳細は https://global-net.co.jp/archives/11877 に。
#Seminar #AdvancedPackaging #PanelLevel

South Korea will more than double its semiconductor industry budget to 468.5 billion won ($355 million) in 2026, aiming to boost domestic materials and advanced packaging capabilities amid intensifying global competition.
#YonhapInfomax #SemiconductorBudget #KoreaSemiconductorIndustryAssociation #PhysicalAI #AdvancedPackaging #4685BillionWon #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=80022