#surfaceengineering

2025-01-19

Don't miss the next Surface Ventures Keynote from Prof Zhiguang Guo on Thursday 23rd January at 10:00 am GMT. Register now:
my.demio.com/ref/1lozVKvC5c7OU

#webinar #biomimetic #surfaceengineering

2023-04-10

This method offers a solution for those working on #QuantumTech hardware, as it presents a new alternative to chemical-based copper plating. The procedure is simple and efficient and leads to a uniform metal coating. #Sputtering

The magnetron-sputtered coating in our preprint did not show delamination from the glass substrate, even at a critical load of 60 N. This demonstrates the strong adhesion thanks to the unique surface structure created by the laser. #SurfaceEngineering

2023-01-31

🤩Excited to share our latest preprint on #LaserAssisted Two-Step Glass Wafer Metallization! A simple & efficient solution for improved compatibility between glass & metallic films. #MaterialsScience
➡️ dx.doi.org/10.2139/ssrn.434336

Our team at #Matfyz Charles University, #HiLASE Centre & #CVUT have collaborated to bring this innovation to life using laser microstructuring at ambient conditions. The result is a thick layer of the metal film with high adhesion strength & low surface roughness.

This method offers a solution for those working on #QuantumTech hardware, as it presents a new alternative to chemical-based copper plating. The procedure is simple and efficient and leads to well-defined grains and grain boundaries in the metal film. #Sputtering

The magnetron-sputtered coating in our preprint did not show delamination from the glass substrate, even at a critical load of 60 N. This demonstrates the strong adhesion of the metal film to the glass substrate, thanks to the unique surface structure created by the laser. #SurfaceEngineering

This method of glass metallization will be a game-changer for those in the field of high-frequency electronic devices. The preprint outlines a practical solution for the realization of glass-based circuit materials, offering a more cost-effective alternative to chemical-based copper plating.

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